Changxin Memory Soars to New Heights with a Race-Ahead DDR5-8000 and High-Capacity Memory at China Expo
November 23 witnessed Changxin Memory's earthshaking entry into the global semiconductor market at the China International Semiconductor Expo (IC China 2025). The corporation officially launched its new generation DDR5 product series, with specifications on performance rivaling the best in the world, featuring speeds reaching 8000Mbps and granular capacities reaching up to 24Gb, indicating high-end competitiveness and a new tier reached domestically in storage chips.
Speed Limit Breakthroughs DDR5s at 8000Mbps
It was during this themed presentation-Dual Chip Resonance, 5 Powers Fully Released- that ChangXin Storage disclosed the substantial faste gains in the speed at which memory moves. Currently, processor core counts and AI scale continue. New DDR5 chips now deliver a blistering 8000Mbps.
By the way, the 6400Mbps benchmark is currently high-end PCs and servers benchmark. The new speed offered-8000Mbps-is really something that can hastily be appreciated a 25% higher speed than the 6400Mbps generation, which firmly qualifies these products among the international top tier in their performance level.
Capacity and Module Innovations
The main emphasis was not only on speed but heavily reliant on the density. It also introduced 24Gb high-density granules, apart from the normal 16Gb granules. That means models' loading ability can now be greatly increased along with multitasking efficiency without needing additional physical slots.
The launched matrix of major module products of seven included everything from cloud computing to edge devices:
- Server Solutions: RDIMM, MRDIMM, and TFF MRDIMM modules that target the next generation of server platform support.
- PC and Laptop: UDIMM compatible with mainstream desktops and SODIMM for laptops and compact devices.
- Next Generation of Performance: CUDIMM, CSODIMM modules.
Ready for Overclocking CUDIMM and CSODIMM
Changxin also prides itself for being future ready with the CUDIMM and CSODIMM modules. These modules meet 2024 JEDEC standards and come with Clock Driver Chip (CKD) integrated in them. They address the challenge of high-frequency signal attenuation which is required by most PC and workstation systems for further pushes of clock speeds.
LPDDR5X for Flagship Mobile Devices
It also included the LPDDR5X mobile memory, launched in October for use in server and PC memory, which is the next breakthrough of deployment in the flagship mobile market in low-powered chips with a speed of 10,667Mbps for the flagship mobile market. They have any packaging solutions available in their capacities from 12GB upwards to 32GB.
Strengthening the Supply Chain
According to Luo Xiaodong, who heads ChangXin Storage's market center, AI has driven an explosive demand for DRAM that brought an impact onto both supply and pricing in the world. He stressed that it is one of the ways to gain scale economy to lessen reliance on foreign manufacturers.
As artificial intelligence pushes borders across the "super cycle" of the global storage market, Changxin Storage's entry into high-end products gives the world market a plethora of choices. Furthermore, it focuses on pushing the local industrial ecosystem's high-value added sections.
