MSI Presents New PC Hardware Lineup at CES 2026
MSI is showcasing a new generation of PC hardware at CES 2026, including a full range of motherboards for AMD and a significant paradigm breakthrough in memory technology for Intel platforms. The announcements focus on overclocking performance, ease of use, and increased memory capacities.
New AMD MAX Series Motherboards (X870/B850)
MSI's latest MAX series motherboards for AMD processors span the X870(E) and B850 chipsets. All MAX models share several new features designed for performance tuning.
- Integrated OC Engine: Allows fine frequency adjustment on asynchronous BCLK control that in certain scenarios adds up to 15% gaming performance boost.
- Direct OC Jumper: Provides an option for BCLK real-time adjustments directly within the operating system.
- BCLK Booster: A one-click solution for fast overclocking.
- 64MB BIOS Chip: An upgraded BIOS ROM capacity to support current and future AMD processors.
MEG X870E UNIFY-X MAX
This board is designed purely for extreme overclocking.
- Design: With a 2-DIMM layout it maximizes CPU and DDR5 memory performance.
- Cooling: Enormous thermal solution with Direct Touch Cross Heat-pipe, 9W/mK thermal pads, double-sided EZ M.2 Shield Frozr II.
- Tuning Controller: An exclusive hardware controller for hands-on OC parameter adjustments, clearing CMOS, and managing settings without entering BIOS.
MAG B850 MAX Series
This line comprises three new models: the MAG B850 TOMAHAWK MAX WIFI II, the micro ATX MAG B850M MORTAR MAX WIFI, and an all-white MAG B850 GAMING PLUS MAX WIFI.
- Performance: All of the models have a high-performance power design and include the OC Engine for performance stabilization.
- Connectivity: Wi-Fi 7 and 5G LAN provide fast wired and wireless networking.
- EZ DIY Features: The boards incorporate user-friendly building features, including EZ PCIe Release for easy GPU removal, tool-free EZ M.2 installation, and a simplified EZ Antenna connector.
Intel Platform Breakthrough: 256GB 4-Rank CUDIMM Support
MSI also unveiled a significant achievement for Intel platforms - the world's first motherboard engineered to support 4-Rank CUDIMM memory modules. This invention will undergo a live demonstration during CES on a Z890 prototype motherboard.
- Massive Capacity: This technology allows for an amazing 128GB per memory stick, with a total capacity of 256GB on a 2 DIMM motherboard.
- High Performance: The platform has stable burn-in testing with frequencies of more than 10,000 MT/s (1-Rank).
- Live Demonstration: The CES demo will illustrate improvement by over 63% (OC) on a MSI Intel prototype motherboard in a 256GB CUDIMM configuration.
