SK hynix 1c LPDDR6 DRAM for AI Mobile Devices in 2026
The first 1c LPDDR6 DRAM which SK hynix developed will be used in AI mobile devices during 2026. SK hynix has now confirmed its sixth generation 10nm class (1c) LPDDR6 memory which was first shown to the public in January. The 16Gb module serves as a new benchmark in low power DDR technology which has been created to deliver the high bandwidth needs of on device AI found in 2026 smartphones and tablets. The company will begin mass production operations during the first half of this year after completing its final production setup for worldwide hardware distribution which will begin in the second half of 2026.
The 1c process technology delivers a 33% improvement in data processing speed compared to the capabilities of LPDDR5X devices. The base operating speed of these devices runs at 10.7 Gbps while the 2026 International Solid State Circuits Conference (ISSCC) technical documentation shows that specialized modules can achieve throughputs of 14.4 Gbps. Local AI computation benefits from the expanded bandwidth because it allows devices to handle intricate language models and generative tasks without depending on remote servers.
SK hynix uses both main technologies which enable them to achieve over 20% power savings when compared to their older memory products. The new developments support battery endurance during extended periods of maximum computational power.
- Sub Channel Structure This memory architecture enables the system to activate only those data pathways which are necessary for executing a particular operation. The system achieves substantial power savings by blocking the activation of channels which remain unused.
- Dynamic Voltage and Frequency Scaling (DVFS) This memory voltage and frequency adjustment system updates its operational settings throughout the day. The system uses DVFS to boost bandwidth capacity during high performance gaming sessions. The system decreases both voltage and frequency during regular operation in order to save power resources.
The 1c 10nm process has reached commercial readiness as of March 10 after completing its verification process. The company intends to use this technology for its upcoming AI memory business. The rollout follows this schedule
- First Half of 2026 Completion of mass production infrastructure and final testing.
- Second Half of 2026 Mobile manufacturers will receive their first product shipments which provide components for their premium AI enabled devices.
SK hynix has developed the 1c node as a solution which allows current AI applications to access high bandwidth requirements while maintaining mobile device power and thermal limitations. The upcoming advanced mobile devices will use these modules to extend battery performance and enhance multitasking capabilities.
