Intel Foundry and Cadence partner to accelerate Intel 14A node design with agentic AI based tools and co optimization
Intel Foundry and Cadence have signed a multi year collaboration that will accelerate design technology co optimization for upcoming silicon manufacturing processes. As stated in a joint press release corroborated by Intel Foundry's social media channel, the collaboration will begin with the upcoming Intel 14A node. The partnership leverages Cadence's agentic AI based EDA and design IP alongside Intel's manufacturing and packaging technologies.
This co optimization initiative will focus on improving tools, flows and design methodologies to achieve better performance, power consumption, and physical silicon area. By partnering during the early stages of process development, the two companies expect to provide design kits ready for production in the next process technology node. This collaborative effort seeks to speed up time to market for their semiconductor customers and lower both the technical and financial risk of designing in the most advanced process technology nodes.
Both companies stressed the importance of the partnership. Cadence's CEO Anirudh Devgan "described the deep partnership as a milestone that will allow designers to achieve previously unattainable levels of performance and power efficiency".
Naga Chandrasekaran, executive vice president of Intel Foundry explained that coupling Intel's advanced packaging and silicon nodes with Cadence's intelligent and automated tools "makes them a more robust and competitive combination for the scale and performance demands of the global market."
