LG Innotek Shows 'Copper Post' Tech for Chip Making
LG Innotek has shown a new tech named "Copper Post," made to help makers build thinner phones with better heat control. This change trades old solder balls that link chips to motherboards, which might make more room inside for things like big batteries.
How Copper Post Tech Works
This way uses a new style of putting chips on. Not using big solder balls, the method has special copper stands, or racks, set right on the chip base. Then, small solder balls are placed on top of these copper posts.
This setup hits two main tech aims:
- It cuts the gap between soldering spots by about 20%, making parts tighter.
- It keeps strong electric flow even with the tighter setup.
The Main Gains Space and Cooling
The Copper Post tech brings big perks for modern mobile gear:
Small Size: By saving space at the chip level, it lets devices be slimmer or lets other parts be added.
Better Heat Flow: Copper moves heat seven times better than standard solder stuff. This pulls heat from processors faster, lessening the chance of getting too hot, signal drops, and slowed performance.
Making and Future Use
LG Innotek started making the copper stand tech in 2021, using digital 3D sims in the work, and has since got about 40 patents. The firm plans to use the tech soon in parts including:
- Radio frequency parts (RF-SiP)
- Processors for phones and wearables
LG Innotek believes this new way of assembly will really change the chip field.