SK hynix Sets Eyes on Top Memory Spot with New EUV for 1c DRAM
SK hynix is making a big and bold move in its tech game. It plans to use a top-notch six-layer Extreme Ultraviolet (EUV) litho way for its new 1c DRAM. This step is aimed to boost the power of its DDR5 and High-Bandwidth Memory (HBM) items and grab a top spot in the chip market.
The Move to a Six-Layer EUV Way
The heart of this big step is in how it’s made. By shifting from old mix of litho ways to a six-EUV-layer way, SK hynix can get finer and more full-on wiring. EUV tech, using a 13.5-nm light, lets them print tinier bits with fewer steps. This change should lead to more chips made well, better working, and more saving power in their memory chips.
What This Means for Future Tech
Though the tech bits are hard, the big real-world effects of this change matter a lot for buyers and tech pros. Here are the main areas that will feel the change:
- Next-Gen PCs for Users: Even though 1c DRAM isn't in user tech yet, its build could set a new bar for PC memory. Soon, DDR5 RAM could hold way more, maybe making 64GB or 128GB of RAM usual in normal work and game machines.
- A Big Jump for AI and Data Spots: The AI field leans a lot on HBM for its huge need for speed. More full, fast, and big HBM4 stacks, made from 1c DRAM, would let AI tools manage bigger and tougher models. This could mean quicker AI learning times and stronger skills.
- Better Power Use: For mobile tools like laptops, memory that uses less power means longer use time without less work, key for people on the move.
A Long Game for Being the Top in Memory
SK hynix’s push for EUV is for the long haul. This move makes a base for future memory types, like 1d and 0a DRAM. It’s also setting up for even newer High-NA EUV systems, which they are working on now. By putting a lot into this tech now, SK hynix aims to stay strong as memory needs grow in all areas.
