SK hynix Introduces New Mobile DRAM to Solve Smartphone Overheating
SK hynix Introduces brand new Mobile DRAM technology that solves the problem of overheating in smartphones. Now, SK hynix introduced a new mobile DRAM that dealt directly with the problem of overheating in smartphones. The company has developed a first in the industry 'Molding Compound' for its memory chips, which according to the company, improves thermal conductivity by 350 percent and minimizes throttling, which is vital in terms of applications run with on-device AI.
Innovation "High-K Epoxy Molding Compound"
The new material is called 'High-K Epoxy Molding Compound'. To dissipate heat more effectively, it works by incorporating Alumina into the normal Silica of the compound, a method that highly improves heat transfer.
This becomes very important because in modern designs, mobile DRAM is often stacked directly on top of the main chipset within the smartphone. Space has thus been saved, and speed of data transfer has dramatically increased. But, it causes heat to be concentrated, so performance degrades under heavy load.
Benefits Related to Performance and Users
The following are the actual benefits of this innovative technology:
- Thermal Conductivity: Increase by 360%.
- Vertical Thermal Resistance from heat source: Improve by 50%.
- Expected Impact to Users: These chips will allow smartphones to perform better under reduced throttling conditions. This may also mean improved battery life.
A 'Significant Milestone' for Smartphone Users
However, according to Lee Gyu-jei, head of Package Product Development at SK hynix, this advance has more critical import for consumers.
"It is a very meaningful achievement that goes beyond simple performance enhancements; it touches on the inconvenience that many high-performance smartphone users may have had," he added. "We will strive to consolidate our technology leadership firmly in the next generation mobile DRAM market."
When it will be available
Industry observers speculate that these chips will not appear in actual smartphones yet, but one of the first to have onboard the advanced cooling technology will be flagship devices which are expected to be launched in 2026 according to SK hyinx.
