Russian 350nm Lithography Machine Nears Setup for Domestic Semiconductor Production

Russia is setting up its first domestic 350nm lithography machine for semiconductor manufacturing on 200mm wafers, with a future 130nm machine.
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Russian 350nm Lithography Machine Nears Setup for Domestic Semiconductor Production

Russia's First Domestic Lithography Machine Details Emerge

Almost ready to be set up on the site of Russian semiconductor manufacture is the first lithography machine with a 350nm resolution produced on a domestic basis. Thus far, technical specifications on the new equipment have been disclosed to the public by the media.

Technical Specifications and Applications

The lithography machine will be used for the production of super large integrated circuits (SLICs) defined by a topological standard of 350nm. Chips manufactured by this technology will be used for power components in several sectors such as automotive and industrial applications.

Major specifications of the machinery include:

  • Resolution: 350nm
  • Wafer Processing Size: 200mm in Diameter
  • Working Field Area: 22x22 mm
  • Working Wavelength: 365 nm

Future Development 130nm Lithography

The report also confirms the already ongoing development of further equipment. A lithograph with 130nm resolution is under development but an anticipated commercial launch date has not been set.

Source: CNews.

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