Samsung and SK Hynix Start 12-layer HBM4 Tests for NVIDIA
Samsung and SK Hynix have started their tests for 12-layer HBM4 technologies which will be used to create memory products for NVIDIA. Samsung Electronics prepares to join the supply chain while SK Hynix maintains its position as market leader by completing final product testing procedures.
SK Hynix Testing and Optimization Progress
SK Hynix has provided NVIDIA with new HBM4 samples which will be used to confirm their quality standards. The company planned to complete quality testing by the previous year but needed to extend the deadline because it required sample updates for quality enhancement.
SK Hynix currently sells its updated samples which it submitted at the beginning of this month while it evaluates new samples which need testing. The additional test results will be made available to the public during the first quarter of this year.
The development timeline for SK Hynix has proceeded as follows:
- September 2023 Initial customer samples supplied to NVIDIA.
The testing process of System-in-Package (SiP) testing resulted in a complete redesign of the circuitry. The organization currently distributes updated samples at a monthly rate of 50000 wafers which NVIDIA uses for its pilot production of the upcoming Rubin architecture.
Samsung Electronics and Mass Production
Samsung Electronics has made significant progress in quality testing which enables them to commence mass production in the upcoming month. The testing process will not slow down SK Hynix because the company expects to remain the leading supplier for NVIDIA throughout the entire year.
Market Share and Pricing Parity
SK Hynix has obtained a contract which enables them to supply 60% of NVIDIA's total HBM4 requirements for this year according to industry experts. NVIDIA will receive supplies according to the order which quality tests finish because the company maintains its 60% market share of 12-layer HBM3E products from the previous period.
Pricing dynamics have undergone significant changes between the two leading semiconductor manufacturers from South Korea. The following pricing information has been reported:
- Pricing Parity Samsung and SK Hynix have agreed to supply HBM4 to NVIDIA at similar price points.
Samsung previously sold 12-layer HBM3E products to customers at prices which were about 30% lower than SK Hynix products. Industry sources predict that the 12-layer HBM4 product will have a price tag that surpasses $600.
Technical Adjustments
NVIDIA requirements have been continuously updated throughout the development process. Officials stated that the HBM4 base die underwent modifications to support higher speed requirements. The design margin needed to be maintained through TSMC consultation which enabled performance enhancements while sustaining yield results.
Source: dealsite Kr
