Samsung Exynos 2700 Performance, Cooling Updates Reported
Insider reports have revealed some promising news on the upcoming flagship Exynos 2700 from Samsung. This System-on-Chip (SoC) will address critical issues seen in earlier models but, more importantly, improve performance levels.
Manufacturing Process and Performance Expectations
The chip will allegedly be fabricated on the 2-nm SF2P process, featuring a new Gate-All-Around GAA architecture which is expected to bring 12% performance gains and a 25% decrease in power consumption compared to Exynos 2600.
Insider claims regarding the performance of the new SoC include:
- New C2 Ultra and C2 Pro cores would run up to 4.2 GHz.
- Estimated Geekbench 6 single-core score of 4,800.
- Estimated Geekbench 6 multicore score at 15,000.
New Packaging to Mitigate Heating
For the alleviation of thermal issues, Samsung plans to employ the new FOWLP-SbS (Side-by-Side) packaging method. In this plan, the processor die and DRAM are flanked next to each other and placed under a single copper heat spreader, deviating from a traditional vertical arrangement. This configuration shall deliver enormous benefit with heat dissipation under heavy loads and avoid throttling of the CPU.
System-wide Performance Improvements
The reports also suggested additional solid expectations - 40% overall SoC performance boost owing to a combination of the newly integrated AMD Xclipse chip and support for LPDDR6 RAM and UFS 5.0 storage.
However, it must be noted that these insider reports remained unconfirmed by any official statement from Samsung.
