Samsung HBM4 to be Showcased with NVIDIA's Rubin at GTC 2026
Samsung Electronics will present its sixth-generation high-bandwidth memory HBM4 at NVIDIA's GTC 2026 convention which will begin its official launch in March. The new HBM4 memory will be shown at the event together with NVIDIA's upcoming AI accelerator which has the code name Rubin.
Production and Supply Timeline
Samsung has succeeded in HBM4 final HBM4 quality tests which both NVIDIA and AMD conducted according to semiconductor industry sources. The company will start producing HBM4 memory in mass quantities starting next month.
- NVIDIA will receive its first batch of HBM4 units in February which represents the first time those units will be produced at a large scale.
- At the GTC event in March those units will demonstrate how the Rubin AI accelerator performs.
- Production will reach full-scale supply when customers complete their final product manufacturing processes which will begin around June.
Technical Specifications and Performance
Samsung's HBM4 operates at 11.7 Gb/s which exceeds the minimum 10 Gb/s speed requirement established by NVIDIA and AMD. The company successfully completed verification testing without needing any redesign work after a customer requested enhanced performance during the previous year. The technology has achieved maturity because the system passed verification testing without the need for redesign work according to the company.
Market Position and Strategic Importance
The industry considers this development to establish Samsung's memory technology leadership as the new standard. The company has closed its technological gap with HBM3 and HBM3E products through the development of HBM4. The company intends to regain its previous status as the top provider of high-performance memory products through this strategic move.
