Wiwynn Transforms into Full AI Data Center System Integrator Presenting Next Gen Computing Power Advanced Cooling and Optical Interconnects at COMPUTEX
Wiwynn, provider of server hardware infrastructure for AI servers, will greatly increase its presence in the COMPUTEX exhibition. This year, the company will showcase more than 50 new products in collaboration with its parent company Wistron, with over 20 industry partners to feature at its display. At the exhibition, next gen AI computing and storage systems, advanced power distribution, and heat dissipation technology will be showcased for data centers of enormous scale.
Lin Weiyuan, general manager and CEO of the company, will announce that it is pivoting from a traditional hardware assembly model to a full scale AI data center system integrator. This updated corporate strategy emphasizes integrated computing power, high speed data transmission, power supply, and heat dissipation. This shift will be illustrated with four core technological pillars that tackle the challenges in running large scale AI workloads:
First, is next gen AI computing and storage systems capable of various chip architectures. Product displays will show cabinet level solutions designed for top semiconductor vendors like NVIDIA Rubin architecture, and AMD Helios system hardware. This ability to support different types of processors will answer various customer demands, as data centers evolve from general GPUs to specialized application specific ICs ASICs.
Second is the high voltage DC power distribution system designed for the enormous power needed for high end AI processors, which offer low loss and stable electricity than conventional AC system. This system will reduce total operating costs and energy loss for data centers which constantly run high intensity computing workloads.
Third is the breakthrough in optical interconnect and high speed data transmission. The increase of processor speed becomes bottleneck of the server performance due to physical data transfer limits. This display will be composed of a system using Co Package Optics technology where physical bandwidth limitations is solved by transmitting data through optical fiber instead of electronic signal.
Fourth is the system thermal management. As high density computing clusters combined with optical communication technology bring immense heat and system failures. Wiwynn utilizes its accumulated engineering experience to provide cutting edge cooling technology to secure high performance and system stability during demanding tasks. These advanced cooling technology could prevent the system from thermal throttle while minimizing overall operating cost in running AI installations.
