Intel Foundry Leadership Changes Appoint Seok Hee Lee as Executive Vice President of Advanced Packaging and Refine Roles for Naga Chandrasekaran and Navid Shahriari
Intel Corporation announced a new key member to its leadership team by naming Seok Hee Lee as the executive vice president of Intel Foundry. Seok Hee Lee will be reporting directly to the CEO, Lip Bu Tan, and would be responsible for advanced packaging, system integration, back end technology development, and back end manufacturing. As per the official Intel Corporation release, the new organization setup would create an independent advanced packaging business to manage the growing complexity of AI systems.
Before his current role at Intel, Lee was known to have gained a substantial amount of the experience in industry through his career that include the capability of re defining the world leading business. As the former presient and CEO of SK On, and former specailist with top engineering decision at SK hynix, and reporting to the chief of all engineerill position at Intel, and is believed having some knowledge of the manufacturing culture and management at Intel. CEO of the said that Lee have the right operation knowledge capable of working with foundry customers employing the high volume processes of EMIB T and HBI.
Advanced packaging and system integration are emerging as second to none capabilities of the next generation of computing system.
In this new operating model, Naga Chandrasekaran will still report directly to Tan in addition to his new reporting line as executive vice president, Intel foundry. Chandrasekaran will have sole responsibility for front end technology development, front end manufacturing and the acceleration/ volume ramp for the Intel 18A and Intel 14A process nodes and continue to lead design enablement, customer facing services and business enablement in order to optimize capacity for foundry partners outside of Intel.
Looking ahead to his new position, Lee was optimistic about the company's technology path during the growth of system integration requirements in major high performance computing markets.
Intel, with its propensity for leading in advanced packaging, is well suited to grow as demand for system level integration accelerates across AI and high performance computing.
Along this iteration of leadership, Intel also announced the imminent retirement of executive vice president, Navid Shahriari. Mr. Shahriari will retire after 37 years with Intel, where his engineering work helped establish Intel's back end manufacturing and packaging technologies, concluding his technical leadership after leadingthe company into its new, redefined foundry business.
