TSMC has approved a massive $29.44 billion USD capital budget to accelerate advanced chip production and packaging capabilities. The foundry giant also announced a new partnership with Sony to develop next generation image sensors, backed by an investment up to 282 billion Yen. This aggressive expansion aligns with record breaking quarterly earnings fueled by high performance computing demands.
Financial results for Q2 show consolidated sales hitting 1.27 trillion NTD with net profits reaching 706.56 billion NTD. Earnings per share settled at 27.25 NTD. Strong demand for AI accelerators and premium smartphones kept factories running at high capacity. Investors will also receive a cash dividend of 7 NTD per share for the quarter, with the payout scheduled for early next year.
Foreign shareholders get some regulatory relief with this dividend round. Complying with updated local financial regulations, TSMC will now let international investors receive their cash payouts directly in US dollars. For those holding American Depositary Receipts on the New York Stock Exchange, the ex dividend and record dates are scheduled for late this year.
The board approved the $29.44 billion USD budget specifically to construct new facilities and upgrade mature, advanced, and specialty nodes. This funding represents a fresh allocation of capital rather than a revision to annual spending guidance. TSMC wants to stay ahead of rivals as global demand for advanced packaging and high end computing silicon climbs.
The newly approved alliance with Sony Semiconductor Solutions Corporation focuses heavily on CMOS image technology. TSMC plans to spend up to 282 billion Yen to secure its equity stake in the joint venture. By combining Sony image sensor expertise with TSMC manufacturing scale, the partners aim to capture market share in edge AI, automotive electronics, and machine vision systems.
