SK Hynix Unveils World's First 12-Layer HBM4 Memory: 2TB/s Bandwidth for AI & HPC

SK Hynix samples the first 12-layer HBM4 memory, achieving 2TB/s bandwidth and 36GB capacity.
SK Hynix Unveils World's First 12-Layer HBM4 Memory: 2TB/s Bandwidth for AI & HPC

SK Hynix Unveils World's First 12-Layer HBM4 Memory

SK Hynix, a leader in memory solutions, has announced a significant advancement. They are sampling the world's first 12-layer HBM4 memory. This is a major leap in memory performance, designed to accelerate high-performance computing and AI applications.

Breaking the Bandwidth Barrier: 2TB/s and Beyond

The 12-layer HBM4 from SK Hynix achieves unprecedented data flow. It boasts a bandwidth capable of processing over 2 terabytes of data per second. This speed represents a 60% increase over HBM3E, marking a revolution in data processing capabilities.

Capacity That Redefines Limits: 36GB per Stack

This next-generation memory offers substantial capacity. Each stack holds 36GB. This density is enabled by SK Hynix's enhanced Advanced MR-MUF process. This technology improves capacity and stability while efficiently managing heat, which is critical for high-speed memory.

Leading the HBM Race: Ahead of the Curve

SK Hynix is a known pioneer in the HBM market. They were first to mass-produce HBM3 and HBM3E. Now, they are extending their lead with HBM4. This announcement underscores their market leadership as they move to the next generation while others focus on HBM3E.

Collaboration Fuels Innovation: NVIDIA and TSMC

This advancement is a result of industry collaboration. SK Hynix partnered with TSMC, utilizing TSMC's 3nm process for the HBM4 base die. Reportedly, NVIDIA CEO Jensen Huang's personal request accelerated the development, highlighting the strong demand for this technology in the AI sector. HBM4 memory is expected to power demanding applications, potentially including NVIDIA's next-generation Rubin GPUs.

Showcasing the Future at GTC 2025

SK Hynix will showcase its HBM innovations at NVIDIA's GTC 2025 AI conference. They will present the HBM4 model alongside their 12-High HBM3E and SOCAMM memory products. This display emphasizes their broad portfolio for AI and high-performance computing.

A New Era of Memory Dawns

SK Hynix's HBM4 12-layer represents a significant technological advancement. It is a key driver for innovation across industries. As AI, machine learning, and data-intensive applications grow, memory solutions like HBM4 will be fundamental. The memory revolution is underway, and SK Hynix is at the forefront.

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