MediaTek Launches Dimensity 9500 Flagship Chipset on TSMC's 3nm Process
The Dimensity 9500 was unveiled by MediaTek as its most advanced smartphone system-on-chip (SoC). Manufactured through TSMC's latest 3nm 'N3P' architecture, the chipset derives major improvements in performance and energy efficiency. Its next-generation C1 cores developed by ARM.
Performance Architecture of CPU
The performance level of Dimensity 9500 is much advanced relative to its predecessor. MediaTek says the maximum peak power draw is reduced by 37% while single-threaded performance is increased by as much as 32% compared to Dimensity 9400. The CPU has an 8-core configuration and is built on "all performance core" using ARM's latest C1 architecture. The specifications of this specific cluster are given below:
- 1x ARM C1-Ultra Core @ 4.21GHz (2MB L2 cache)
- 3x ARM C1-Premium Cores @ 3.50GHz (1MB L2 cache each)
- 4x ARM C1-Pro Cores @ 2.70GHz (512KB L2 cache each)
The SoC features 16MB of L3 cache and 10MB of SLC cache, and it is supportive of ARM’s SME 2 (Scalable Matrix Extension) instruction set. In the benchmarks, MediaTek claims that the Dimensity 9500 can yield 4,007 points on a single-core score, and 11,217 points on a multi-core score, results which are very much in-line with the A19 Pro's.
GPU and Gaming Features
The new ARM Mali-G1 Ultra comes with the chipset. Significant enhancements in the GPU department include:
- Double the ray tracing cores.
- Up to 33% increase in peak performance.
- 42% improvement in power efficiency at peak performance.
- Up to 119% faster ray tracing performance.
- Can deliver 120FPS gameplay.
- Supports Unreal Engine 5.5+.
While the GPU has PC-style gaming capabilities, many AAA titles will still be available through emulation on Android devices until such time as native versions are created for the platform.
AI and Neural Processing
Dimensity 9500 is complemented with new NPU 990 with MediaTek's second-generation Gen-AI engine. This new Neural Processing Unit surpasses that of the Dimensity 9400 as it is 111% more efficient, possesses much greater than double speed in token generation, and consumes 40% less power. It can also create significantly higher quality images at 4K resolution.
Connectivity Features
Built into the integrated 5G modem is the 5CC-CA standard, which ultimately provides the highest possible downlink speed of 7.4Gbps under the sub-6GHz band. Other improvements in connectivity include the following:
- UltraSave technology: With AI traffic prediction, save 10% more power.
- Smart Multi-Link call: Prevents call drops by making dual network connectivity available through cellular and Wi-Fi.
- Wi-Fi and Bluetooth: Acceleration of file transfer through Wi-Fi is by 20%, and 35% extension for Bluetooth audio.
- AI-GNSS: Up to 20% more accurate location information with a significant near-instant fix.
Availability
The smartphones with the MediaTek Dimensity 9500 on board will be announced soon after this. Further parameters on performance and efficiency metrics will become available with the launch of such devices.
