UCLA Engineers Identify Tantalum Nitride as Record Breaking Thermal Conductor
UCLA engineers made a historic discovery by finding the most thermally conductive metal that scientists have ever documented. The theta phase of tantalum nitride (TaN₍θ₎) establishes a new benchmark for thermal management in high performance electronic devices.
Scientists use Watts per meter Kelvin (W/mK) to measure the thermal conductivity of materials. The discovery shows that TaN₍θ₎ significantly outperforms the traditional industry standards used for over a century. The following data presents a comparison of two different things
- Tantalum Nitride (TaN₍θ₎) Approximately 1100 W/mK
- Silver Approximately 400 W/mK
- Copper Approximately 400 W/mK
The data shows that tantalum nitride can conduct heat almost three times better than present cooling substances when tested in optimal laboratory conditions.
The exceptional thermal properties of TaN₍θ₎ are attributed to its hexagonal crystal lattice structure. In typical metals, heat transfer is often hindered by the interaction between electrons and phonons. Tantalum nitride has a special structure that decreases electron phonon interactions, which enables energy to move through the material without facing significant obstacles. The matter demonstrates thermal conductivity properties which exceed the limitations established by classical theories for metal substances.
The discovery is particularly relevant to the current expansion of artificial intelligence (AI) infrastructure. Modern data centers and AI processors generate extreme heat, which exceeds the copper based cooling systems maximum cooling capacity. The implementation of 1100 W/mK conductive material will enhance hardware temperature regulation while boosting energy efficiency in congested computing environments.
Although researchers have confirmed the material characteristics the next step involves establishing connections with worldwide supply networks. The practical application of our solution will depend on three main factors
- The capability to produce theta phase tantalum nitride at industrial scale.
- The cost of manufacturing brass which must be measured against copper expenses.
- The period required to incorporate new components into current cooling technologies.
Date of Announcement February 1 2026
