Samsung Electronics Prioritizes Internal Foundry Resources at Pyeongtaek to Achieve Maximum HBM4 Production Capacity and Market Leadership through Vertical Management of AI Memory Components in 2026
Samsung achieves maximum production capacity for HBM4 through its internal foundry operations which get priority treatment. Samsung Electronics holds the leading position in the High Bandwidth Memory (HBM4) market through its decision to vertically manage all manufacturing operations in 2026. The production cycle for these 6th generation chips currently spans four to five months, which exceeds the typical DRAM production time because of the intricate process that combines vertical tier stacking with advanced packaging methods. Samsung employs a turnkey system which unifies its memory and foundry and packaging operations into one comprehensive service solution.
Pyeongtaek Foundry Lines undergo a strategic process to reallocate their operational resources. Samsung plans to use its Pyeongtaek foundry facilities for HBM4 production requirements which constitute a vital element of its 2026 operational roadmap. The Pyeongtaek line currently allocates more than 50% of its manufacturing capacity to create HBM4 base dies instead of producing products for external client contracts. The facility operates 4nm to 7nm processes which have reached over 90% utilization since the company decided to focus on AI memory components that deliver high value.
The 4nm node operates as the base die process because it establishes power stability for power consumption control. The internal HBM4 requirements consume more than 15,000 wafers from the total monthly capacity of 30,000 wafers which includes both internal and external demands. The base die will undergo power capacitor expansion to support AI accelerators which require low power operation and high performance capability.
The AI field has experienced increased demand from major organizations such as Nvidia, AMD, and OpenAI which led to production resources being redirected toward these clients. The HBM4 memory modules have seen their market value increase because they are now required for next generation Grok 3 inference and training chips. Samsung chose to concentrate its operations on the HBM4 supply chain after the price of memory modules increased.
The HBM4 base die functions as the primary processing unit for the complete stack structure which differs from previous generations when base dies performed a simpler function. The base die now serves as the main point of distinction because all clients require specific performance characteristics. Samsung has established production control over its die manufacturing process at its foundry which allows the company to resolve production delays while achieving significant delivery achievements for its top AI clients.
HBM4E and Custom Solutions lead the way for future HBM4E development. Samsung will increase its HBM production capacity through its HBM4E and Custom HBM products because the semiconductor industry anticipates future market growth and rising demand for these products. The upcoming product versions will restrict the foundry manufacturing process to matching requirements for memory stack construction. 90% of Pyeongtaek's current utilization rate at Samsung indicates that internal order fulfillment will replace external foundry service demand as the company strengthens its position in the highly profitable AI memory market.
The 7th generation development process at HBM4E Development has begun its initial stage with the integrated turnkey model. Direct client collaboration establishes a framework to develop base dies which serve specific application requirements. The integrated package system which provides DRAM base dies and packaging materials results in production time savings because it takes 1.5 times longer to produce compared to the non integrated production methods used by competitors.
