SK Hynix Researches Intel EMIB Bridge Technology to Diversify AI Memory Packaging and Secure Global Supply Chain Stability
SK Hynix is currently investigating the feasibility of integrating Intel's leading edge 2.5D packaging technology with its high bandwidth memory products. According to reporting by ZDNet KR, the South Korean memory maker has started to research and develop testing on Intel's Embedded Multi die Interconnect Bridge technology. Through this initiative, SK Hynix aims to determine if it's possible to stack its high bandwidth memory alongside system semiconductors using Intel's specialty substrates. Individuals involved in the matter noted that SK Hynix is already searching for suitable materials suppliers to support mass production with this technology, if all goes well.
This is likely due to severe supply shortages in AI accelerators as most semiconductor companies in the industry struggle to keep up with extreme global demand from tech giants. The 2.5D packaging supply chain is almost entirely dominated by TSMC and its Chip on Wafer on Substrate technology. The sheer demand from major hardware makers has stretched TSMC's supply chain to its limit. This is compelling major hardware designers to investigate using Intel's bridge architecture as an alternative to the TSMC based standard. While SK Hynix has a very close partnership with TSMC, testing on Intel's technology is a signal that the memory maker wants to ensure internal security in future generations of memories.
Intel has apparently begun advocating for its bridge technology by approaching major OSATs to increase its market presence in advanced packaging. Unlike interposers that span large areas, Intel's method only use silicon bridges where interconnects between chips are needed. This is expected to provide for more efficient silicon placement as well as reduce overall cost as only necessary bridging occurs. A representative from the industry said this concerning the present day circumstances
It is crucial for SK Hynix to conduct research on Intel's methods of packaging, so they are able to optimize their yield of high bandwidth memory. In the event they can not take care of their own full 2.5D assembly process, the understanding of the structural characteristics of the Intel bridge will enable SK Hynix to design stable and easier to manage memories. SK Hynix has a specialized R&D line in Korea solely dedicated to this research of these advanced 2.5D structures in order to prevent any delays in production and allow for better performance of the memories when working with other foundry's CPUs.
By utilizing the high bandwidth memory from a premier supplier, Intel will have the chance to further justify its advanced packaging business. The addition of a second large supplier will likely bring stability in production of AI accelerators as global demand will only continue to grow, and this initiative demonstrates that high performance computation will be a mix of heterogeneous suppliers of both logic and memory.
