Asetek Emma V3 and Ingrid G9 Liquid Cooling Platforms Debuts with Improved Thermal Performance

Asetek Emma V3 and Ingrid G9 Liquid Cooling Platforms Debuts with Improved Thermal Performance

Asetek Launches Emma V3 Gen10 and Ingrid G9 Liquid Cooling Solutions with Performance Gains for Gaming and Workstations

Asetek has developed an all new liquid cooling system to tame the heat loads of the new generation of desktop and professional workstation CPUs. Per the Asetek technical documentation release Asetek is releasing this with 2 different systems catering to different markets. The flagship design released today is the Emma V3 Gen10 architecture with completely reengineered internal water block and optimized microchannel configuration to maximize cooling of the silicon itself.

The mechanical changes in the Emma V3 Gen10 have produced a 1.5°C reduction in thermal resistance compared to previous Asetek cooling designs, while noise levels have been reduced by approximately 45% through acoustic pump design optimization. A new dual offset contact plate design helps with multi core CPUs as it directly addresses modern CPU's concentrated heat zones by centering the cold plate over these. The first place to find this Gen10 design integrated into a system is with ASUS on their special ROG motherboard.

Also today Asetek highlighted the already wide spread use of their value orientated Ingrid G9 platform that can be found in current retail cooling solutions from partners NZXT ADATA and TRYX. This design sees a 3°C improvement over previous designs. It is tailored for mainstream gaming where low cost and low noise are high priorities for high load home computing.

Workstation and AI hardware, including an enterprise workstation design to handle sustained heat loads of over 450 watts is being developed in tandem with Phanteks and ASUS for the newest line of high end CPUs from Intel and AMD including Xeon and Threadripper processors with large unified heat spreaders and corresponding huge cold plate designs.

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