Qualcomm SM8975 Flagship SoC Architecture Leak Confirms Native Tri Fold Display Support and Two Physical Chip Variants with LPDDR6 Memory
Qualcomm's upcoming SM8975 flagship SoC, along with its architecture, was leaked The most prominent aspect of the new design is that it will be the world's first mobile processor to natively support advanced multi folding form factors,as evidenced by display pipelines designed for a tri fold display along with an external cover screen. These hardware support means a triple foldable device powered by anSM8975is surely on its way
It seems the SM8975 leak has finally brought an end to confusion regarding Qualcomm's development of its flagship processor with a leaked source revealing that only 2 physical versions of the SM8975 will be manufactured by Qualcomm,not 6,as previously speculated on social platform X. Qualcomm will release just 2 physical variants of its next generation flagship SoC;however,there are total 3 revisions for these 2 physical chips making the total engineering samples count to 6. The reason behind the confusion in the Databases is that Qualcomm has designed up to 3 versions of the same SM8975 that is due to manufacturing process or silicon revises making total up to 6 variations listed in databases.
SM8975 (mmWave/sub6) block diagrams
— Reptalica (@Reptalicant) June 18, 2026
p.s : who hallucinated 6 variants of SM8975? there is 2 variants, and they both has gone though 3 revisions, so 6 engineering samples
there will only be 2 SM8975s (LP5X and LP6) at launch, with the same clockspeed pic.twitter.com/xxpN4TNWDz
Both of the these 2 SM8975 variants,that are targeting the market will be available to users with the similar clock frequencies at the initial stage and what differs these processors will be the memory controller design along with packaged on packaged layout. One of the two will have support for the current LPDDR5X memory support,while the other version will boast support for the next genLPDDR6 memory controllers. Both the SoC variants are provided with a custom Oryon CPU subsystem,and an always sensing camera with A. I support,the latter of which is powered by a dedicated QualComm AI NPU, coupled with a power sipping low power AI subsystem taking care of always on features like voice calls and audio streamings. The LEAKED diagrams also provide the information of the two slightly varied RF/Modem setup that will be available with the two variations and one is stated to paired with a SDR885 transciever,the latter having a dedicated Lora module for IoT devices and sensors.
