REDMI K90 Ultra Gaming Flagship Launch Announced Featuring Snapdragon 8 Elite Chip and Integrated Active Cooling Fan for High Performance
REDMI has announced the first official information regarding the launch of REDMI K90 Ultra. The manufacturer announced through the official communication channels that the respective model will be launched in Chinese territory later this month as the first promotional materials were leaked. The visual promoted renders reveal a silver colored chassis in addition to a significant design departure of the rear side.
On the back the form factor of the camera housing is a large, rectangular shape placed adjacent to a built in active cooling fan. In this context, REDMI are branding this particular model as a 'heavy duty' gaming flagship designed to keep up with marathon sessions. The integrated fan pairs with a sophisticated heat management system to prevent thermal throttling so the frame rate remains constant even during intensive GPU tasks such as at max settings.
This physical cooling element is an unusual engineering decision on an average smartphone and simply illustrates the level of commitment that the manufacturer has to maintain a high performance handset. Cooling the heat rapidly to outside of the silicon indicates the active cooling design.
The processing horsepower on the REDMI K90 Ultra comes courtesy of the flagship Snapdragon 8 Elite chip. The 8500 mAh cell, also a significant step larger than modern flagship sizes, is supported by 100 W of fast charge power.
Equipped with a high capacity battery, active thermal management, and a state of the art mobile processor, the device is designed for "the upcoming era of high end mobile gaming". Further information about the global roll out and retail pricing is anticipated in the lead up to the release internationally later on this month.
