Rambus has released the first power management integrated circuit designed for LPDDR6 SOCAMM2 memory modules, with sample silicon now shipping to industry partners. The new chip establishes power delivery standards for modular low power memory intended for enterprise servers and client computers. Current market modules rely on LPDDR5X, making this release an early step toward next generation memory hardware.
SOCAMM2 provides a modular, replaceable format for low power memory, combining high bandwidth with reduced energy consumption. Multiple processor manufacturers are adopting the standard for datacenter and edge systems. NVIDIA uses SOCAMM2 on select processors, while AMD plans to add support on its upcoming EPYC 9006 LP Verano server chips. Replacing soldered memory with swappable modules gives hardware builders more configuration choices without sacrificing signal integrity.
Rambus operates as 1 of the 3 leading memory interface chip suppliers globally. Delivering dedicated power management silicon allows hardware partners to begin testing and validating LPDDR6 SOCAMM2 designs before commercial memory chips enter volume production. Controlling voltages directly on the memory module reduces electrical load on host boards and improves power efficiency across dense computing clusters.
