xMEMS has entered mass production for its µCooling line of all silicon solid state active cooling chips. The hardware uses ultrasonic piezoelectric pulses to move air through micro valve arrays, measuring as thin as 1.13 millimeters. Commercial manufacturing covers 2 distinct chip sizes aimed at edge AI hardware, smartphones, and data center solid state drives.
The µCooling platform replaces traditional fans with thin film piezoelectric materials bonded directly to silicon. High frequency expansion and contraction of this layer create ultrasonic motion. An on chip array of precision micro valves transforms this motion into high speed air pulses that pull heat away from internal components. The complete silicon package measures 1.13 millimeters in thickness and carries an IP68 rating for protection against water and dust infiltration.
xMEMS manufactures 2 models in this production run. The medium size XMC 2400 produces an airflow rate of 28 ml/s alongside 1300 Pa of backpressure, designed for compact edge AI hardware including XR smart glasses. The larger XMC 4800 produces an airflow rate of 48 ml/s with 1100 Pa of backpressure. This higher capacity variant targets heat dissipation requirements in smartphones and enterprise solid state drives operating in data centers.
