MediaTek Dimensity 7300
The MediaTek Dimensity 7300 is an ARM-based mid-range SoC for (mostly Android based) smartphones. The integrated CPU is divided into two clusters:
- Performance cluster: four larger ARM Cortex-A78 cores with up to 2.5 GHz clock speed
- Efficiency cluster: four ARM Cortex-A55 cores with up to 2 GHz
In addition to the integrated ARM Mali-G615 MC2 iGPU, the 7300 also offers a MediaTek APU 655 for AI tasks. Furthermore, a 5G multi-mode modem is installed (2G - 5G) with up to 3.27 Gbps download speed. It also supports Wi-Fi 6E and Bluetooth 5.4.
The chip is manufactured using the modern 4nm process and is advertised to consume 25% less power compared to the older Dimensity 7050.
Specifications:
| Feature | Details |
|---|---|
| Series | MediaTek Dimensity |
| CPU |
|
| GPU | ARM Mali-G615 MP2 |
| AI Processor | MediaTek APU 655 |
| Modem | 5G multi-mode (2G-5G), up to 3.27 Gbps download speed |
| Connectivity | Wi-Fi 6E, Bluetooth 5.4 |
| Manufacturing Process | 4 nm |
Benchmarks:
Please note that benchmark scores are just one aspect of performance and can vary depending on factors like software optimization and thermal conditions.
| Benchmark | Score |
|---|---|
| Geekbench 6.2 Single-Core | 1016 points |
| Geekbench 6.2 Multi-Core | 2630 points |
| Antutu v9 Total Score | 536090 points |
