Micron Technology has begun disseminating samples of its next-generation HBM4 memory to its key industry partners for different performance evaluations, giving room for the next-level architecture promises in speed and capacity enhancements for future artificial intelligence systems.
As of now, the samples are a 12-layer high (12-Hi) solution which comes with a huge 36GB available per stack. These HBM4 modules should enable data transfer speeds beyond 2 Terabytes per second (TB/s).
Micron highlights this development as an extension of its leadership in creating high-performance, power-efficient memory tailored for AI applications. HBM4 is based on Micron's 1ß (1-beta) DRAM process technology and has a proven 12-layer advanced packaging. It includes MBIST (memory built-in self-test) to ensure easy integration into next-generation AI platforms.
Micron's HBM4 gives advancements on many fronts, considering that generative AI will become the main modality of demand for balancing AI inference problems.
- It has a 2048-bit interface, which is one of the contributors to its great speeds of over 2.0 TB/s per stack.
- It is an increase above 60% over the performance of the previous HBM generation.
- The superior interface and high data throughput are expected to accelerate how large language models and complex AI reasoning systems perform, which means a more agile and better response from AI accelerators.
- Micron further said that HBM4 provides over 20% better power savings compared to its previous HBM3E products, which should further enhance the efficiency of data centers by maximizing throughput while minimizing power consumption.
According to Micron, HBM4 is to become one of the main pillars of the continuing AI revolution with quicker insights and breakthroughs across many sectors such as healthcare, finance, and transportation.
For almost 50 years, Micron has been at the forefront of memory and storage technology. HBM4 is part of Micron's promise to keep speeding up AI with solutions on converting data into actionable intelligence.
HBM4 will be commercially produced on mass by Micron with effect from the year 2026. This time frame is intended to synchronize with the launch schedules of its customers' next-generation AI platforms.
