Samsung HBM4 AI Memory Mass Production and Specifications
Samsung has introduced HBM4 as the first commercial solution for AI processing in the industry. The mass production and commercial distribution of HBM4 High Bandwidth Memory has begun according to Samsung Electronics announcement. The company developed its first 6th generation 10nm class 1c DRAM process together with a 4nm logic base die. The system will provide the necessary performance and thermal capacity to support upcoming AI data center operations.
The memory system HBM4 delivers an uninterrupted data transfer rate of 11.7 Gbps which surpasses the existing 8 Gbps industry standard by 46 percent. The system can achieve 13 Gbps for data processing of extensive AI model systems according to Samsung.
The system achieves a maximum data transfer rate of 3.3 TB/s per stack which represents a 2.7 times improvement compared to HBM3E. The company currently offers 12 layer stacks which provide memory capacities between 24GB and 36GB. The company plans to introduce a 16 layer stack which will offer 48GB of memory capacity in the future.
The new generation of HBM4 provides 2,048 data I/O pins which shows a 100 percent increase from the previous generation's 1,024 data I/O pins. The design team at Samsung implemented low voltage through silicon via technology to handle higher power consumption from increased pin designs. The optimizations deliver power efficiency that exceeds HBM3E standards by 40 percent. The thermal resistance has been enhanced by 10 percent while the heat dissipation performance has improved by 30 percent which helps GPU systems operate reliably in crowded environments.
The Design Technology Co Optimization DTCO system from Samsung operates as a unified system which enables Foundry and Memory businesses to produce goods more efficiently. The company predicts that its HBM sales will increase by more than three times during 2026 because it will expand its production capabilities to handle rising AI demand.
The upcoming three years will see Samsung develop new memory technologies which depend on these upcoming developments
HBM4E Sampling will start to take place during the second half of 2026. Partners will receive specialized HBM samples from the company in 2027. The company introduced HBM4 to reduce datacenter operating costs by enhancing GPU performance and power consumption optimization.
