Hardware

Arm AGI CPU Silicon Launch for Data Center Agentic AI Systems and High Rack Efficiency with Meta Partnerships

Arm AGI CPU Transitions the Company to Physical Silicon Production to Support Global Agentic AI Data Center Infrastructure and High Density Rack Eff…

Global PC Market Price Increases Driven by Component Shortages as ASUS Reports Rise of AI PCs and Windows on ARM Another 30% in Q2

Global PC Market Facing Substantial Price Increases Due to Component Shortages as ASUS and Major Manufacturers Shift Toward AI PCs and Windows on AR…

Samsung SK Hynix China AI Semiconductor Infrastructure Expansion for DRAM and NAND Flash Production Upgrades

Samsung and SK Hynix Invest Trillions to Upgrade Chinese Semiconductor Plants for DRAM and NAND Flash to Meet Global AI Infrastructure Demand …

Huawei Atlas 350 AI Accelerator Ascend 950PR Chip Performance Specifications and Future 2026 Hardware Roadmap

Huawei Launches Atlas 350 AI Accelerator With Ascend 950PR Technology Outperforming Competitors and Outlining 2026 Product Roadmap Huawei …

Kioxia GP Series SSD AI Memory Expansion for GPU Storage Layers using XL FLASH and NVIDIA Storage Next

Kioxia GP Series SSD Provides a Critical Memory Layer for Artificial Intelligence by Expanding GPU Capacity Through XL FLASH and NVIDIA Storage Next…

NVIDIA Feynman AI Chip TSMC A16 capacity constraints lead to hybrid design for next generation 2028 high performance hardware

NVIDIA Feynman AI Chip Design Reflects Advanced TSMC Capacity Constraints and Hybrid Manufacturing Strategies for 2028 Release Reports reg…

Samsung HBM4 Femtosecond Laser Technology for High Bandwidth Memory and Next Generation Chip Quality

Samsung Electronics Adopts Femtosecond Laser Cutting Technology to Enhance High Bandwidth Memory 4 Production Yield and Improve Semiconductor Chip Q…

SK Hynix AI Memory Production Increases at M15X Plant to Address Global High Bandwidth Memory Shortages and Market Demand

SK Hynix Accelerates M15X Facility Production Timelines to Boost DRAM and High Bandwidth Memory Output for Global AI Hardware Demands and Market Com…

Samsung HBM4E and AI Infrastructure at NVIDIA GTC 2026 Showcase New Semiconductor Memory and SSD Solutions

Samsung Reveals Sixth Generation HBM4 Memory Plus HBM4E Chips and Advanced AI Infrastructure Solutions at NVIDIA GTC 2026 Exhibition Samsu…

Samsung HBM4 Market Lead GTC 2026 High Speed Memory Achievement and HBM4E HBM5 Roadmap Competition with SK Hynix

Samsung Takes High Speed Memory Lead at GTC 2026 with 4nm HBM4 Technology While Planning Future HBM4E and HBM5 Roadmap Beyond Rivals Samsu…

Exascend PE4 16TB SSD First M2 NVMe Storage Solution Pricing Performance Specs and Enterprise Market Availability

Exascend PE4 Launches the First M2 16TB SSD with PCIe 4.0 Technology High Endurance TBW and Professional Grade Performance for Enterprise Storage Ma…

Intel CPU prices increase 10 percent causing retail hardware costs to rise amid AI infrastructure supply shortages

Intel CPU prices increase 10 percent as AI data center expansion and soaring memory costs force manufacturers to raise laptop prices by 40 percent …

Samsung HBM4 Production Capacity and Internal Foundry Priority for AI Memory Market Growth and HBM4E Development

Samsung Electronics Prioritizes Internal Foundry Resources at Pyeongtaek to Achieve Maximum HBM4 Production Capacity and Market Leadership through V…

Sony IMX908 Image Sensor for 4K Surveillance CCTV Cameras with LOFIC and STARVIS 3 for HDR Professional Monitoring

Sony IMX908 Image Sensor Details for Professional 4K CCTV Systems Including LOFIC STARVIS 3 Technologies for High Dynamic Range and Motion Artifact …

Intel Core Ultra 3 205T PassMark Performance Details Architecture Specifications and Comparison Rankings for Budget Desktop CPUs

Intel Core Ultra 3 205T Processor Benchmarks Reveal Eight Core Architecture Performance Scores and Comparison to Earlier Generation CPU Models …

Xbox Game Pass March April 2026 Library Updates Including Disco Elysium Resident Evil 7 and Expedition 33

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