Mitsui Kinzoku MicroThin Copper Foil Prices Increase Twelve Percent for Electronic and Semiconductor Industries Starting April 2026

Mitsui Kinzoku announces a 12 percent price increase for MicroThin copper foil products starting April 2026 due to rising material and labor costs.
Mitsui Kinzoku MicroThin Copper Foil Prices Increase Twelve Percent for Electronic and Semiconductor Industries Starting April 2026

Mitsui Kinzoku Will Raise MicroThin Copper Foil Prices by 12 Percent

Mitsui Kinzoku will raise MicroThin Copper Foil prices by 12 percent. The company Mitsui Kinzoku Co. Ltd. has sent out an official announcement to its partner companies about a mandatory price increase for its MicroThin copper foil products. The company will start its 12 percent price increase on all products from April 2026. The company made this choice after dealing with continuous increases in operational costs and unpredictable changes in raw material prices.

The Copper Foil Division led by Senior General Manager Tatsuya Sudo reported that external economic conditions have created an environment which requires them to change their current pricing model. The 12% adjustment is a direct response to the following factors

  • LME Copper Prices The London Metal Exchange (LME) has experienced substantial increases in copper prices which have increased the expenses associated with acquiring raw materials.
  • Labor Expenses The rising expenses for skilled workers have increased the total production overhead costs.
  • Operational Expenses The overall cost of production rose because of the general increases in manufacturing related expenses.

The adjustment affects all MicroThin copper foil products because it extends beyond particular grades. Customers should prepare for these changes to take effect on all orders starting April 2026. The table below shows the manufacturer provided adjustment details

Product Category Price Adjustment Percentage
All MicroThin™ Copper Foil Types +12% (USD)

Mitsui Kinzoku has become a major supplier to both the electronics and semiconductor industries. This move by the company will signal a major shift in the industry as manufacturers face challenges from rising commodity costs. Companies using MicroThin foil for their high density interconnects and advanced circuit boards must account for this 12 percent increase in their production budgets scheduled for H2 2026.

The company has indicated that while the decision was made after careful consideration of production costs it is necessary to maintain the quality and service levels of their copper foil supply chain. The Mitsui Kinzoku Copper Foil Division handles all contract inquiries regarding specific contracts.

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