Qualcomm has introduced the Dragonwing Q 2390 and IQ 2390 processors to bring edge artificial intelligence to consumer appliances and factory machinery. Both chips combine a 4 core Kryo CPU with an Adreno 704 GPU and a dedicated real time RISC V controller. Qualcomm plans to showcase the silicon at IFA 2026 ahead of hardware evaluation kits rolling out in early 2027.
The Dragonwing Q 2390 targets smart home hardware, retail checkout terminals, and consumer robots. It packs application compute, display support, camera interfaces, GPS location tracking, and LTE Cat 4 cellular connectivity into 1 platform. Running computer vision and machine learning tasks directly on the hardware helps manufacturers avoid constant cloud computing fees. Developers can target multiple operating systems including Linux, Android, and Zephyr OS.
AI is creating a fundamental shift in how connected devices are designed and deployed, but many product categories still face barriers around cost, complexity and integration. With the Dragonwing Q 2390 and IQ 2390 processors, we are enabling intelligence to scale across a much broader range of devices.
Industrial automation demands hardware that survives punishing factory conditions. The Dragonwing IQ 2390 steps in as the first entry in the new IQ2 family, targeting power grids, oil facilities, and automated assembly lines. It adds dual Gigabit Ethernet with Time Sensitive Networking for deterministic data delivery. Qualcomm engineered the physical package to operate in thermal environments ranging from minus 30 degrees to plus 115 degrees Celsius, with built in resistance to heavy physical shock and vibration.
Hardware partners have already started building production boards around the silicon. Fibocom is developing the SC236 smart module for payment devices and handheld computers. SECO and Engicam are working on single board computers and modular systems for industrial automation. Qualcomm confirmed that early customer testing is active now, with broader evaluation kits reaching the market in early 2027.
