European processor startup SiPearl has finalized a strategic development and investment agreement with Taiwanese design specialist Egis. The partnership centers on building Rhea2, a next generation server processor built on the shared Mobius100 platform. Mass production for the underlying architecture is scheduled for the second half of 2028.
Egis subsidiary Alcor Micro developed the core Mobius100 design that Rhea2 will adopt. The chip runs on Arm Neoverse V3 architecture and relies on TSMC N3P lithography. A dual chiplet package delivers 128 active cores alongside 12 redundant cores designed to improve factory production yields.
Memory controllers support DDR5 MRDIMM modules reaching transfer rates of 12800MT/s. For peripheral connections, the processor supplies PCIe Gen6 and CXL Gen3 pathways. Physical chip communication uses IP from InPsytech, another Egis subsidiary, integrating 8 UCIe 2.0 S interconnect ports across the package.
Engineering samples for the Mobius100 silicon are slated to arrive in 2027. Full volume manufacturing will follow in the second half of 2028. SiPearl plans to launch Rhea2 into the high performance compute market shortly after production begins.
