South Korean PCB supplier TLB has entered early development talks with 2 memory manufacturers to design next generation SOCAMM3 memory modules. The technology is expected to enter volume production in 2028 and may launch alongside the upcoming NVIDIA Rosa CPU. However, participating companies have yet to finalize core specifications.
According to a report from The Elec, TLB currently produces printed circuit boards for existing SOCAMM hardware and plans to expand fabrication capabilities for the new standard. Manufacturing SOCAMM3 introduces major engineering hurdles compared to the prior generation. Current SOCAMM2 boards require a 5 step lamination process. SOCAMM3 increases this stacking count further, making the microvias connecting each internal layer substantially harder to drill and align.
TLB is coordinating directly with its memory partners to solve these manufacturing bottlenecks before commercial deployment begins. NVIDIA is expected to be a primary consumer for this memory format as enterprise computing demands higher bandwidth in compact modular form factors. Full production timelines point to 2028, giving supply chain partners roughly 2 years to refine yields and finalize board standards.
