Kyocera has announced the DIGNO BX4, a rugged enterprise smartphone built for the Japanese market through SoftBank. The device pairs a MediaTek Dimensity 6400 processor with a promise of 4 major Android version upgrades and 5 years of security patches. Commercial distribution is planned for the domestic market, while global launch details have not been released.
The chassis measures 74 by 156 by 9.9 millimeters and weighs 185 grams. Up front, users get a 6.1 inch HD+ IPS LCD screen paired with an 8MP selfie camera. The display supports touch inputs with wet hands as well as operation while wearing work gloves. The entire build meets MIL STD 810H shock resistance standards alongside dust and water protection. Biometric access is handled through a fingerprint scanner and facial recognition.
Kyocera equips the device with a MediaTek Dimensity 6400 processor alongside 8GB of RAM and 128GB of internal storage. A 4500mAh battery powers the system, supporting 33W fast charging. The smartphone runs Android and carries the official Android Enterprise Recommended certification for corporate fleet management. Physical connectivity includes a dedicated headphone jack and NFC with FeliCa support for contactless mobile payments.
The rear camera module houses a 50MP main sensor for field documentation and daily imaging. On the software side, the device includes a call recording tool that can capture up to 60 minutes per conversation and store up to 100 separate audio files. This tool activates after a call begins to help employees record important client details without third party software.
